EECT 2022

Due to the COVID-19 outbreak,EECT 2022 was adjusted to be held via Zoom. Prof. Om P. Malik from University of Calgary, A/Professor Farhad Shahnia from Murdoch University, Prof. Graziano Chesi from The University of Hong Kong, Prof. Nikolaos Freris from University of Science and Technology of China, Dr. Michael Waltl from TU Wien, Vienna, Austria, Europe have attended the conference as Speaker and share their latest research, many researchers, engineers, academicians as well as industrial professionals from all over the world have also presented their research results and development activities.

EECT 2022 Best presenter

Fan Zhang, CNNC Key Laboratory on Nuclear Industry Simulation, China
Presentation Title: Research of text visualization in 3D environment based on parameter study

Snawar Hussain, Central South University, China
Presentation Title: Compact Scattering Features for Glaucoma Detection

Licheng Xing, Yanshan University, China
Presentation Title: Research on the Partition Method Based on the Observation Points of Voltage Distortion in Harmonic Optimization

All papers included in EECT 2022 conference proceeding published in Journal of Physics: Conference Series, Volume 2253, 2022 and indexed by EI and Scopus within 2 month.

 

EECT 2021

The 2021 International Conference on Electrical, Electronics and Computing Technology (EECT 2021) was planned to held from March 26-28, 2021 in Xiamen, China, considering the COVID-19, the conference was changed to held online.

 

Best Presenter:

Session I:
T1003-Amandeep Gill (JECRC University Jaipur, India)
Title: Optimal penetration of distributed generation system in radial distribution network using adaptive scheme

Session 2:
T1203-Wang Yuxiang (Beijing Institute of Technology, China)
Title: DCSNet: A Surface Defect Classification and Segmentation Model by One-Class Learning

Paper Publication and indexing

EECT 2021 conference proceeding published in Journal of Physics: Conference Series, Volume 1914, 2021 and indexed by EI and Scopus within 3 month.